Quantum Hardware Engineer, Advanced Packaging
- Bachelor's degree in a technical field (e.g., Mechanical Engineering, Applied Physics, or Physics) or equivalent practical experience.
- 5 years of experience building mechanical and thermal stress models to evaluate structural design over huge temperature ranges.
- Experience performing mechanical and thermal simulations using industry standard tools.
- Experience with software design/development in Python, collaborative coding, version control, and library maintenance.
- Experience with mechanical, thermal, and multi-physics simulations for electronics and related systems in cryogenic environments.
- Experience with superconducting materials and device/package design.
- Knowledge of mechanical, PCB, and/or silicon fabrication principles and the constraints they impose on physical device design.
- Knowledge of electronics packaging and fabrication processes.
About the job
As a Quantum Hardware Engineer, you will solve the team’s mechanical and thermal integration challenges. This includes building finite element analysis models using industry standard software, such as Ansys Mechanical, to evaluate both thermal and structural performance of new package designs over a wide temperature range. You will work directly with research scientists and other hardware engineers to develop mechanical, thermal, and multiphysics models for our packaging and integration hardware stack including quantum processors, amplifiers, packaging, I/O and associated filtering. You will also seek out and develop partnerships with vendors and other entities to advance our knowledge and capabilities to meet our quantum roadmap milestones. You will bring curiosity and engineering intuition to develop the understanding needed to improve superconducting quantum hardware performance, and expertise to pave the way for rapidly increasing the number of qubits in accordance with our roadmap.
Google Research is building the next generation of intelligent systems for all Google products. To achieve this, we’re working on projects that utilize the latest computer science techniques developed by skilled software engineers and research scientists. Google Research teams collaborate closely with other teams across Google, maintaining the flexibility and versatility required to adapt new projects and foci that meet the demands of the world's fast-paced business needs.
- Develop a mechanical simulation workflow compatible with existing mechanical design tools.
- Develop thermal, structural, and multiphysics models to inform advanced packaging designs and material selections.
- Interface with simulation software application engineers to build and deploy accurate and efficient Finite Element Analysis (FEA) models.
- Interact with other team members, including test engineers to define mechanical and thermal tests.
- Use test results to refine simulations and close the loop between simulation, design and test, notably in the context of increasing quantum processor performance.
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