Minimum qualifications:

• Bachelor's degree in Electrical or Mechanical Engineering, or equivalent practical experience.
  
• 6 years of experience in applying Design for Reliability techniques.
  
• Experience in reliability physics, statistical analysis (JMP, Weibull), lifetime, and FIT projection of semiconductor ICs.
  

Preferred qualifications:

• Master's degree or PhD in Electrical Engineering, Material Science, Mechanical Engineering, Physics, or a related field.
  
• 6 years of experience in design, development, reliability qualification, and production of advanced IC packages including FOWLP, FOPLP, WLCSP, PoP, 2.5D, and 3D.
  
• Experience in semiconductor failure analysis tools such as SEM, TEM, FIB, EDX, CSAM, Nanoprobe, CT Scan, X-Ray, and Decapping.
  
• Background in package and board-level reliability (TCoB, Mechanical Shock, Shadow Moire, and MLB strain) testing.
  
• Background in reliability physics, statistical analysis (Design Expert, JMP, Weibull), lifetime, FIT, failure rate projection of semiconductor devices and components.